Photoresist datasheet. So with increasing film thickness .
Photoresist datasheet Technical datasheet AZ® 15nXT Series Negative Tone i-line Photoresists APPLICATIONS Fast, negative tone cross linking photoresists featuring extreme thermal stability, superb dry etch resistance, and superior high energy ion implant blocking power. So with increasing film thickness AZ® IPS-6000 Series Photoresist Chemically Amplified Positive Tone Photoresist APPLICATIONS Thick positive tone chemically amplified photoresist featuring aspect ratios and photospeed not possible with conventional DNQ type materials. Most of these data sheets and specification sheets are only available in English. In this dimension, a diverse range of organic compounds are harnessed to create a revolutionary class of materials that respond to light in extraordinary ways. These photoresists expose and develop very quickly for improved equipment productivity and reduced chemical usage. . 0μm require a rehydration hold between soft bake and exposure. Here you can download technical data sheets for our products. Plating process condition Photoresist thickness: 15um, Prebake: 110C/180 sec. Hold times are typically 30-60 minutes (depending upon film thickness) @ relative humidity 40 - 45%. Excellent stability in a wide variety of plating bath chemistries. It provides high resolution with superior aspect ratios, as well as wide focus and exposure latitude and good sidewall profiles. If you are setting up a spin coating process, you may find useful our free Spin speed calculator. P4000 photoresist films thicker than 4. AZ® 9200 photore-sist is available in two viscosity grades for film thicknesses of 4 to 24 μm. When using a standard photoresist at film thicknesses above 3 μm, the necessary exposure energy drastically increases. GENERAL INFORMATION This series of positive photoresists is intended for applications where coating thicknesses above 3 μm are required. We would like to show you a description here but the site won’t allow us. This is due to the absorption of the photoactive compound (PAC) in the actinic range of the spectrum. Plating process condition Photoresist thickness: 15um, Prebake: 110 C / 180 sec (Hotplate) Exposure: PLA-501F(Soft contact, ghi-line aligner) Development: AZ 400K 1:4, Immersion for 300 sec, 23 C Plating liquid: MICROFAB Cu200 (EEJA) Plating height: 7. Resists of AZ’s 1500 series can be developed in a variety We would like to show you a description here but the site won’t allow us. AZ® 9200 thick film photoresist is designed for the more demanding higher-resolution thick resist require-ments. , 23 C Plating liquid: MICROFAB Cu200 (EEJA) Plating height: 7. 0um, Plating: 25 C / 30 min. (Hotplate) Exposure: PLA-501F(Soft contact, ghi-line aligner) Development: AZ 400K 1:4, Immersion for 300 sec. AZ P4620 Datasheet for MICROPOSIT S1800 series photoresists: features, properties, process parameters for microelectronics IC fabrication. AZ9260 Photoresist Summary of Results: Exposure Latitude on Silicon, 40μm L/S Film Thickness: 24 μm Optitrac coat and Bake SB: 1st layer 110°C/ 80 sec 2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner 20 μm proximity gap AZ 300 MIF, 720 sec continuous spray @ 23 °C Photoresist Datasheet: Specifications, Applications & BenefitsImagine a realm where science meets artistry, where the power of light can shape and transform our physical world. APPLICATION Thick positive tone chemically amplified photoresist featuring aspect ratios and photospeed not possible with conventional DNQ type materials. To download the datasheets you have to register. Critical dimension resolutions range from < 1 μm lines The photoresists are sub-grouped by common properties to: General Purpose Thin Film Photoresists, Thick Film Photoresist, Metal Lift-off Resists and Other Propose Resists and ordered in alphabetic order. Various viscosity grades are available for a multitude of applications and dyed versions are engineered to control reflective notching. Wide exposure latitude and good resolution and depth of focus improve yield and throughput. AZ 1500 Photoresist AZ 1500 series positive photoresists are well established g-line and broad-band resists. AZ® 1500 Series Positive Tone Photoresist APPLICATION General purpose positive tone photoresists featuring excellent substrate adhesion for demanding wet etch applications. These light-sensitive substances, with their mesmerizing AZ 3312 Photoresist (18cps) Data Package The information contained herein is, as far as we are aware, true and accurate. hcktxkubxumhawzeimzffiijoxiuwwdgvfhwhtqtowlwcshddloarzansbnfwrdeuoanfewr